Damage analysis on faulty assemblies
Finding and correcting defects in realtime: using X-ray inspection we are able to analyse populated and unpopulated multilayer printed circuit boards, power modules, connections such as ball grid arrays (BGA) or quad flat packages (QFN), gullwing pins, integrated circuits (ICs), bonding wires, chips and much more. Thanks to the high speed and the resolution with which the 2D X-ray inspection can be undertaken, damage and defects can be detected and rectified during manufacture. Expensive complaints and recalls are therefore avoided.
- Quick, cost-effective inspection
- Ability to detect detail down to 0.5 µm
- Random, small batch and 100% inspections
- Reliable detection of defects in realtime
- Quality assurance and material analyses
- Defect analyses, e.g. pores (voids), inclusions, cracks, misalignment, solder bridges and much more
- Non-destructive analysis of internal and external structures
- Automatic solder joint inspection on, e.g., BGAs, gullwing pins or integrated circuits (ICs)
- Process control
- Non-destructive inspection for complaints
- Location of the region of interest (ROI) and preliminary inspection for destructive testing on a prepared specimen
Application examples of 2D X-ray inspection
Inspection of a mems sensor
Check of soldering (oblique view)
Solder joint inspection at bga-modul
Solder joint inspection at bga-modul
Pore ratio in solder joints
Evaluation of tht solder joints
Inspection of an integrated circuit (ic)
Assessment of bond wires
Control of pores, bond wires and pins
Applications for industrial X-ray inspection
Non-destructive measurement and inspection methods
Detecting and rectifying defects quickly and effectively
2d x-ray inspection
2D X-ray inspection uses an X-ray source that emits radiation with a conical pattern toward the item inspected. Radiation that passes through the component is acquired by a detector on the opposite side and the data are converted into an X-ray image. Here it is possible to inspect a very wide range of materials such as metal, ceramic, plastic and composite materials, and even sintered material, solar cells, multilayer printed circuit boards and castings.
Automated X-ray inspection
Automated X-ray inspection (AXI) makes it possible to inspect fully populated printed circuit boards quickly and reliably. The X-ray images are evaluated automatically using a special software application. The high speed makes this method ideal for 100% quality control in series production. The X-rays allow inner structures such as contacts, steps, solder bridges, solder flow, faulty soldered joints or incorrect melting of the solder to be verified.
Planar computed tomography, planar CT for short, is used if components with a large area or populated printed circuit boards and boards with a complex design are to be analysed using X-rays. Along with a high resolution, this method is distinguished above all by the possibility of depicting a component in several virtual layers without overlapping. For this reason this method is often used during the inspection of multilayer printed circuit boards.
ADDED VALUE AT QUALITY ANALYSIS
You receive from us precise measurement results, even at short notice. We have both the necessary personnel and a large range of equipment with excellent X-ray machines.
We provide highly precise measurements of workpieces, initial samples and series production components of any size and in any quantity. For this purpose, we have more than 1,000 m² of accredited, permanently air-conditioned measuring rooms.
Range of equipment
Our versatile range of systems includes various 2D X-ray systems. We acquire all workpieces digitally using the 2D method, irrespective of weight, material density and geometry.
The accreditation of our inspection methods and measuring rooms signifies for you certainty, dependability and objectivity.
Accredited test laboratory for 2d x-ray inspection
Our measurement methods for components made of non-metallic and metallic materials, plastics, composite materials and organic materials in accordance with recognised standards (VDI/VDE 2617 and DIN EN ISO 10360) are accredited by Deutsche Akkreditierungsstelle GmbH (DAkkS) in accordance with DIN EN ISO/IEC 17025. Furthermore, all our other specialist areas have also been accredited. You can read more about the advantages our accreditation offers you here:
Applications for 2d x-ray inspection
Industrial X-ray inspection is used in a very wide range of sectors. The focus is always on the non-destructive inspection of internal and external structures, the analysis of soldered joints and defect analysis. Listed in the following are applications of importance for us:
Automotive und Mobility
Industrial X-ray inspection is used during the manufacture of automotive components such as connectors, sensors and electronic control units (ECUs) for the detection of shrinkage cavities, pores, inclusions and other material defects. Industrial X-ray inspection is also used during the non-destructive analysis of battery cells, e.g. during random checks for foreign objects, gas bubbles or metallic inclusions.
For the non-destructive inspection of BGA soldered joints, we use automated X-ray inspection (AXI). We analyse the distance between the balls of solder, the solder gradient or joint clearance, verify wetting and dewetting defects and analyse solder joint anomalies, e.g. excess solder, cracks, pores and shrinkage cavities, bridge formation or fractures in the solder joint. 2D X-ray inspection is also used for checking populated and unpopulated multilayer printed circuit boards, power modules, gullwing pins, integrated circuits (ICs) or bonding wires.
Connections and connectors
We use X-ray inspection for defect analysis and quality control on electrical connectors, crimped connections and cable connections. The high-resolution X-ray images help to identify quality features and material defects and to safeguard the functionality. Non-destructive inspection also offers significant advantages for locating the cause of the damage during damage analysis.
Quick, cost-effective analyses are a major advantage particularly for random, small batch and 100% inspections. In the area of consumer electronics, quality control for sensors plays a major role. Here we analyse material structures inside the component and verify the quality of the soldered joints.
Frequently asked questions
What is the difference between 2d x-ray inspection and industrial computed tomography?
Both 2D X-ray machines and industrial computer tomographs operate with X-rays. However, during 2D X-ray inspection classic X-ray images are evaluated, while in CT three-dimensional models of the item inspected are prepared.
What is automated x-ray inspection?
Automated X-ray inspection (AXI) is used in printed circuit board manufacture to detect and rectify quickly defects on the populated printed circuit board. The high speed during the inspection of the printed circuit boards is possible thanks to the automated image analysis. During this process the 2D X-ray images are evaluated automatically by the system.
What resolution is achieved by 2d x-ray inspection?
Our modern X-ray systems achieve a resolution of up to 0.5 µm. In general this resolution is completely sufficient to detect defects on printed circuit boards or their components. If a higher resolution is required, CT or nano CT is used. Nano CT offers resolutions of up to 0.2 µm, however the process is slower than 2D X-ray inspection.
the right partner
for 2d x-ray inspection
What can we measure and analyse for you?
We would be pleased to advise you about the numerous possibilities and combined analytical methods. The goal: the best, most cost-effective and most efficient analysis of your component.