Analysis of electronic assemblies

Complex components require innovative analytical techniques

We analyse and qualify your components as per the acceptance criteria for electronic assemblies (IPC-A-600) and printed circuit boards (IPC-A-610). High-performance reflected light microscopy systems, scanning electron microscopy as well as FIB-SEM analysis are used here.

The following are just some of the possible analyses we can undertake for you on electronic components:

• Analysis of anomalies in inner printed circuit board tracks
• Verification of flux residue
• Evaluation of the quality of the soldering
• Verification and analysis of electrochemical migration
• Analysis and evaluation of assemblies after a stress test
• Assessment of vias in multilayer printed circuit boards

Would you like to find out more about the in-depth analysis of electronic assemblies? Get in touch with our experts without obligation!

>>> Further information about analysis in electronic manufacturing