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ELECTRONICS
MANUFACTURING

Quality Analysis - Elektronikfertigung
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SOLUTIONS FOR MICROELECTRONICS & SEMICONDUCTORS

Holistic quality assurance for the manufacture of microelectronics and semiconductors:

Due to the increasing complexity of microelectronics and semiconductors, the requirements on component and soldering quality are also increasing. The manufacture and assembly of electronic assemblies requires highly accurate work free of contamination. Highly precise, quick, efficient solutions for the inspection, analysis and measurement of microelectronics and semiconductors are required to increase productivity and to reduce defect rates.

The highest resolutions in the micro and nano-range are necessary to inspect visually the component and soldering quality on electronic assemblies. Along with light, electron and X-ray microscopy, non-destructive 2D X-ray analysis and 3D computed tomography offer a quick and effective alternative to locating, analysing and metrologically evaluating hidden defects and weak spots in the interior, also on fully populated assemblies.

We support you with non-destructive and destructive analyses as per the acceptance criteria for electronic assemblies (IPC-A-600) and printed circuit boards (IPC-A-610). Fixed and mobile ESD protection zones as well as certified personnel are available in all areas for the inspection of components sensitive to electrostatic.

ANALYSIS OF A DEFECTIVE CAPACITOR

Defect analysis of a capacitor using light and scanning electron microscopy

  • Depiction and analysis of surface structures
  • Analysis of deposits using EDX material analysis
  • Analysis of the capacitor in longitudinal section

CORRELATIVE PARTICLE ANALYSIS

Extraction and analysis of particulate contamination

  • Liquid extraction with different media
  • ESD safe air extraction using particle suction system
  • Particle analysis by means of light and scanning electron microscopy, RAMAN and FT-IR spectroscopy

SOLDERED JOINT INSPECTION

Non-destructive analysis of the soldering quality using 2D X-ray inspection and 3D computed tomography

  • Analysis of solder joints
  • Slant radiography for the analysis of wetting defects
  • Determination of portion of pores (voids) in solder joints or conductive adhesives

FILMIC CONTAMINATION

Verification and identification of chemical-filmic residues

  • Selective detection by means of fluorescence measurement
  • Verification and material determination by means of RAMAN and FT-IR spectroscopy
  • Qualification and quantification by means of GC-MS and GC-FID

DEPTH ANALYSIS OF A CHIP

Depiction of the layer structure of a chip by means of FIB-SEM microscopy

  • Preparation / production of a cross section
  • Depiction and analysis of the layer structure
  • Material testing by means of EDX material analysis

ANALYSIS OF PRINTED CIRCUIT BOARD TRACKS

Depiction and analysis of the layer structure of printed circuit board tracks

  • Macroscopic and microscopic depiction of coatings
  • Dimensioning of the functional layers in prepared specimen
  • Analysis of flaws in the conductor pattern, e.g. damages to the surface metallisation

SOLUTIONS FOR HOLISTIC QUALITY ASSURANCE IN ELECTRONICS MANUFACTURING

We offer holistic solutions for the inspection, analysis and measurement of microelectronics and semiconductors; during this process we combine our technologies for greater depth of analysis.

The combination of optical inspection with high-resolution depiction of details down to the nano-range, metallographic analysis of component characteristics, defect analysis, cleanliness inspections and surface metrology help you to increase effectiveness and productivity in production.

ANALYSIS OF COATINGS

Depiction and analysis of coatings and their structure, e.g. printed circuit board tracks:

  • Macroscopic and microscopic depiction of coatings
  • Analysis of microstructure and the layer structure in a prepared specimen
  • Material identification using SEM EDX analysis
  • Analysis of flaws in the conductor pattern, e.g. loss of adhesion, reduction of the track width due to notches, pin holes as well as damage to the surface metallisation
  • Analysis of anomalies on the inner tracks such as over and under-etching, track cracks and defects, uneven or unsatisfactory oxidation treatment, e.g. film thickness

SOLDERED JOINT INSPECTION

Non-destructive and destructive inspection of the soldering quality with resolutions in the micro and nano-range:

  • Non-destructive inspection using 2D X-ray analysis and 3D X-ray microscopy
  • Destructive inspection using light and scanning electron microscopy
  • Serial checking for good/bad inspection
  • Analysis of solder joints, e.g. distance between the balls of solder, solder climbing or solder gap thickness
  • Irradiation at an angle for the analysis of wetting and dewetting defects
  • Analysis of solder joint anomalies, e.g. excess solder, pin holes, cracks, pores and cavities, bridge formation or fractures in the solder joint
  • Determination of portion of pores (voids) in solder joints or conductive adhesives

DEFECT ANALYSIS

Defect analysis on failed components using light and scanning electron microscopy:

  • Depiction and analysis of surface structures and flaws, e.g. deposits, burrs, cracks, flaking or fractures
  • Analysis of flaws under the surfaces, e.g. foreign particle inclusions, delamination or bubble formation (blistering)
  • Analysis of anomalies in through-plated holes, e.g. dimensions, needle head formation, thickness of the layer of metallisation or resin smearing
  • Analysis of deposits, e.g. solder paste, using EDX analysis to determine the chemical material composition (halogens such as fluorine, chlorine, bromine and iodine, etc. can be verified explicitly)
  • Light microscopy analysis of various positions in a longitudinal cut

DEPTH ANALYSIS

3D imaging with preparation on nano-scale using FIB-SEM microscopy:

We can analyse the functional layout of high-performance electronics, e.g. chips or wafers using FIB-SEM microscopy. With very low thermal and mechanical effects due to the latest femtosecond laser and gamma ion beam, cross-sections can be produced directly in the material such that delicate layers can be analysed to full depth.

VERIFICATION OF PARTICULATE CONTAMINATION

Foreign particles not embedded or fixed on printed circuit boards can reduce the minimum electrical distance and drastically increase the risk of failure due to leakage currents, or even electrical breakdown. Pressed in particles can also cause malfunctions.

Extraction and analysis of particulate contamination:

  • Verification of organic, inorganic, ionic and non-ionic particles and fibres
  • Liquid extraction using various media
  • Manual and robot-aided air extraction
  • Particle analysis using microscopic and spectroscopic methods for the determination of quantity, size class, material composition and damage behaviour

VERIFICATION OF FILMIC CONTAMINATION

Printed circuit boards are subjected to various forms of chemical-filmic contamination during manufacture, e.g. solder pastes, flux residues or adhesives that can shorten leakage paths and hinder the wettability or solderability if not cleaned correctly.

Verification and identification of contaminating films:

  • Selective detection of contaminating films by means of fluorescence measurement
  • Material identification directly on the component surface using RAMAN and FT-IR spectroscopy
  • Extraction of the contamination using rotary evaporation as well as subsequent qualification and quantification using gas chromatography (GC) coupled to flame ionisation detector (FID) or mass spectrometer (MS)
  • Gravimetric assessment

QUALITY ANALYSIS, THE RIGHT PARTNER FOR YOUR ANALYSIS TASKS IN ELECTRONICS MANUFACTURING

What can we analyse for you?
We would be pleased to advise you about the numerous possibilities and combined analysis methods.
The goal: the best, most cost-effective and most efficient analysis of your component.
Call us, we look forward to hearing from you!

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