SOLUTIONS FOR MICROELECTRONICS & SEMICONDUCTORS

Holistic quality assurance for the manufacture of microelectronics and semiconductors:

Due to the increasing complexity of microelectronics and semiconductors, the requirements on component and soldering quality are also increasing. The manufacture and assembly of electronic assemblies requires highly accurate work free of contamination. Highly precise, quick, efficient solutions for the inspection, analysis and measurement of microelectronics and semiconductors are required to increase productivity and to reduce defect rates.

The highest resolutions in the micro and nano-range are necessary to inspect visually the component and soldering quality on electronic assemblies. Along with light, electron and X-ray microscopy, non-destructive 2D X-ray analysis and 3D computed tomography offer a quick and effective alternative to locating, analysing and metrologically evaluating hidden defects and weak spots in the interior, also on fully populated assemblies.

We support you with non-destructive and destructive analyses as per the acceptance criteria for electronic assemblies (IPC-A-600) and printed circuit boards (IPC-A-610). Fixed and mobile ESD protection zones as well as certified personnel are available in all areas for the inspection of components sensitive to electrostatic.

Quality assurance in electronics production — © lapis2380 - stock.adobe.com

ANALYSIS OF A DEFECTIVE CAPACITOR

Defect analysis of a capacitor using light and scanning electron microscopy

Depiction and analysis of surface structures
Analysis of deposits using EDX material analysis
Analysis of the capacitor in longitudinal section

CORRELATIVE PARTICLE ANALYSIS

Extraction and analysis of particulate contamination

Liquid extraction with different media
ESD safe air extraction using particle suction system
Particle analysis by means of light and scanning electron microscopy, RAMAN and FT-IR spectroscopy

SOLDERED JOINT INSPECTION

Analysis of solder joints for quality assurance

Non-destructive analysis of the soldering quality using 2D X-ray inspection and 3D computed tomography

Analysis of solder joints
Slant radiography for the analysis of wetting defects
Determination of portion of pores (voids) in solder joints or conductive adhesives

FILMIC CONTAMINATION

Detection and identification of chemical-film contamination

Verification and identification of chemical-filmic residues

Selective detection by means of fluorescence measurement
Verification and material determination by means of RAMAN and FT-IR spectroscopy
Qualification and quantification by means of GC-MS and GC-FID

DEPTH ANALYSIS OF A CHIP

Illustration of the layer structure of a chip

Depiction of the layer structure of a chip by means of FIB-SEM microscopy

Preparation / production of a cross section
Depiction and analysis of the layer structure
Material testing by means of EDX material analysis

ANALYSIS OF PRINTED CIRCUIT BOARD TRACKS

Examination of conductor paths using microscopy

Visualisation and analysis of the layer structure of conductor paths

Depiction and analysis of the layer structure of printed circuit board tracks

Macroscopic and microscopic depiction of coatings
Dimensioning of the functional layers in prepared specimen
Analysis of flaws in the conductor pattern, e.g. damages to the surface metallisation

SOLUTIONS FOR HOLISTIC QUALITY ASSURANCE IN ELECTRONICS MANUFACTURING

We offer holistic solutions for the inspection, analysis and measurement of microelectronics and semiconductors; during this process we combine our technologies for greater depth of analysis.

The combination of optical inspection with high-resolution depiction of details down to the nano-range, metallographic analysis of component characteristics, defect analysis, cleanliness inspections and surface metrology help you to increase effectiveness and productivity in production.

ANALYSIS OF COATINGS

Depiction and analysis of coatings and their structure, e.g. printed circuit board tracks:

Macroscopic and microscopic depiction of coatings
Analysis of microstructure and the layer structure in a prepared specimen
Material identification using SEM EDX analysis
Analysis of flaws in the conductor pattern, e.g. loss of adhesion, reduction of the track width due to notches, pin holes as well as damage to the surface metallisation
Analysis of anomalies on the inner tracks such as over and under-etching, track cracks and defects, uneven or unsatisfactory oxidation treatment, e.g. film thickness

SOLDERED JOINT INSPECTION

Non-destructive and destructive inspection of the soldering quality with resolutions in the micro and nano-range:

Non-destructive testing using 2D X-ray analysis and 3D X-ray microscopy
Destructive inspection using light and scanning electron microscopy
Serial checking for good/bad inspection
Analysis of solder joints, e.g. distance between the balls of solder, solder climbing or solder gap thickness
Irradiation at an angle for the analysis of wetting and dewetting defects
Analysis of solder joint anomalies, e.g. excess solder, pin holes, cracks, pores and cavities, bridge formation or fractures in the solder joint
Determination of portion of pores (voids) in solder joints or conductive adhesives

DEFECT ANALYSIS

Defect analysis on failed components using light and scanning electron microscopy:

Depiction and analysis of surface structures and flaws, e.g. deposits, burrs, cracks, flaking or fractures
Analysis of flaws under the surfaces, e.g. foreign particle inclusions, delamination or bubble formation (blistering)
Analysis of anomalies in through-plated holes, e.g. dimensions, needle head formation, thickness of the layer of metallisation or resin smearing
Analysis of deposits, e.g. solder paste, using EDX analysis to determine the chemical material composition (halogens such as fluorine, chlorine, bromine and iodine, etc. can be verified explicitly)
Light microscopy analysis of various positions in a longitudinal cut

DEPTH ANALYSIS

3D imaging with preparation on nano-scale using FIB-SEM microscopy:

We can analyse the functional layout of high-performance electronics, e.g. chips or wafers using FIB-SEM microscopy. With very low thermal and mechanical effects due to the latest femtosecond laser and gamma ion beam, cross-sections can be produced directly in the material such that delicate layers can be analysed to full depth.

VERIFICATION OF PARTICULATE CONTAMINATION

Foreign particles not embedded or fixed on printed circuit boards can reduce the minimum electrical distance and drastically increase the risk of failure due to leakage currents, or even electrical breakdown. Pressed in particles can also cause malfunctions.

Extraction and analysis of particulate contamination:

Verification of organic, inorganic, ionic and non-ionic particles and fibres
Liquid extraction using various media
Manual and robot-aided air extraction
Particle analysis using microscopic and spectroscopic methods for the determination of quantity, size class, material composition and damage behaviour

VERIFICATION OF FILMIC CONTAMINATION

Printed circuit boards are subjected to various forms of chemical-filmic contamination during manufacture, e.g. solder pastes, flux residues or adhesives that can shorten leakage paths and hinder the wettability or solderability if not cleaned correctly.

Verification and identification of contaminating films:

Selective detection of contaminating films by means of fluorescence measurement
Material identification directly on the component surface using RAMAN and FT-IR spectroscopy
Extraction of the contamination using rotary evaporation as well as subsequent qualification and quantification using gas chromatography (GC) coupled to flame ionisation detector (GC-FID) or mass spectrometer (GC-MS)
Gravimetric assessment

Detection and analysis of filmic contaminants

QUALITY ANALYSIS: THE RIGHT PARTNER FOR YOUR ANALYSIS TASKS IN ELECTRONICS MANUFACTURING

What can we analyse for you?
We would be pleased to advise you about the numerous possibilities and combined analysis methods.
The goal: the best, most cost-effective and most efficient analysis of your component.
Call us, we look forward to hearing from you!

Telephone: +49 7022 2796-682