SOLUTIONS FOR MICROELECTRONICS & SEMICONDUCTORS
Holistic quality assurance for the manufacture of microelectronics and semiconductors:
Due to the increasing complexity of microelectronics and semiconductors, the requirements on component and soldering quality are also increasing. The manufacture and assembly of electronic assemblies requires highly accurate work free of contamination. Highly precise, quick, efficient solutions for the inspection, analysis and measurement of microelectronics and semiconductors are required to increase productivity and to reduce defect rates.
The highest resolutions in the micro and nano-range are necessary to inspect visually the component and soldering quality on electronic assemblies. Along with light, electron and X-ray microscopy, non-destructive 2D X-ray analysis and 3D computed tomography offer a quick and effective alternative to locating, analysing and metrologically evaluating hidden defects and weak spots in the interior, also on fully populated assemblies.
We support you with non-destructive and destructive analyses as per the acceptance criteria for electronic assemblies (IPC-A-600) and printed circuit boards (IPC-A-610). Fixed and mobile ESD protection zones as well as certified personnel are available in all areas for the inspection of components sensitive to electrostatic.